Soil chamber device, has soil placing device provided with emission electrode plate and joint, where soil placing device is placed in receiving electrode to form four-electrode connecting structure.
专 利 号 :
CN203350363-U
发 明 人 :
DING J; MA H; TAN J; WANG Y; XU Z; ZENG L; ZENG Q
专利权人 :
CHINA ENERGY CONSTR GROUP GUANGDONG ELEC (CHEN-Non-standard)